kqcircuits.chips.tsv_test

class kqcircuits.chips.tsv_test.TsvTest[source]

Bases: kqcircuits.chips.chip.Chip

Through silicon via test chip.

Consists of arrays of TSVs and metrology segment for crossectional analysis.

build()[source]

Child classes re-define this method to build the PCell.

create_xsection(position, array_form, pitch)[source]
PCell parameters:

  • array_layout (List) - Array layout for TSV in center, default=[2, 2, 2, 6, 14, 2, 14, 14, 2, 2, 14, 14, 2, 14, 6, 2, 2, 2]

  • metrology_pitch (Double) - Pitch in the metrology, default=50, unit=μm

  • cpw_distance (Double) - CPW Placeholder distance, default=100, unit=μm

  • hor_distance (Double) - Horizontal pitch on TSV, default=200, unit=μm

  • ver_distance (Double) - Vertical pitch on TSV, default=500, unit=μm

  • a (Double) - Width of center conductor, default=10, unit=μm

  • b (Double) - Width of gap, default=6, unit=μm

  • n (Int) - Number of points on turns, default=64

  • r (Double) - Turn radius, default=100, unit=μm

  • margin (Double) - Margin of the protection layer, default=5, unit=μm

  • face_ids (List) - Chip face IDs, list of b | t | c, default=['b', 't', 'c']

  • display_name (String) - Name displayed in GUI (empty for default), default=

  • protect_opposite_face (Boolean) - Add opposite face protection too, default=False

  • tsv_type (String) - TSV type, default=Tsv Standard, choices=['Tsv Standard', 'Tsv Ellipse']

  • tsv_diameter (Double) - TSV diameter, default=10, unit=μm

  • tsv_elliptical_width (Double) - TSV elliptical width, default=30, unit=μm

../_images/kqcircuits.chips.tsv_test.png